Qianhe Yibang's Global First 4-Layer 3D DRAM Chip Successfully Lights Up

On August 21, Qianhe Yibang announced that its self-developed global first 4-layer 3D DRAM stacked storage and computing chip has successfully returned to the wafer and lit up, marking the transition of this technology from validation to engineering implementation. This chip adopts a three-dimensional integrated native computing architecture, with data access bandwidth improved by an order of magnitude compared to traditional solutions, while access power consumption, latency, and single data processing costs have all decreased by an order of magnitude. Qianhe Yibang was established in January 2024, incubated by NetEase, and recently completed a Series B financing of over 2 billion yuan.

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